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High-PAS™ - Testing After Saw
USEA has developed proprietary technology for the highly parallel testing of parts after saw. Our technology fixes the die in position after the sawing processes, with minimal x-y displacement. This allows for highly parallel testing of the die at temperatures ranging from -55°C to 200°C on automated test equipment.
High-PAS™ benefits our customers and collaborators both during their engineering and production phases by:
  • Increased Throughput (UPH) - When testing at high volume, USEA's High-PAS™ technology dramatically increases the test speed for chip scale, bumped die, and singulated die on the film frame handler. This is achieved through elimination of jams associated with turret and gravity feed handlers, reduced indexing time between tests, and reduced engineer supervision requirements.
  • Reduced Tooling Costs - The tooling costs for handling chip scale packages on handlers such as turret and gravity feed handlers are avoided when handling the parts on the film frame handler.
  • Reduced Engineering Setup Costs - The engineering time required to implement a change kit on turret and gravity feed handlers is eliminated and replaced with a lower effort alignment pr